These factories, combined with our worldwide technical organization, bring a comprehensive knowledge of the requirements and manufacturing methods required for successful HDI products.
IPC-2226 defines HDI as a printed circuit board with a higher wiring density per unit area than conventional printed circuit boards (PCB). There are different types of HDI features, type I, type II and type III as defined in IPC-2226. In our FAQ you can learn more about the different types.
Please contact your local NCAB Group company if you need further information or assistance, we are happy to help you.
|Feature||NCAB´s technical specification|
|Number of layers||4 – 22 layers standard, 30 layers advanced|
|Technology highlights||Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.|
|HDI builds||1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D|
|Materials||FR4 standard, FR4 high performance, Halogen free FR4, Rogers|
|Copper weights (finished)||18μm – 70μm|
|Minimum track and gap||0.075mm / 0.075mm|
|PCB thickness||0.40mm – 3.20mm|
|Maxmimum dimensions||610mm x 450mm; dependant upon laser drilling machine|
|Surface finishes available||OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers|
|Minimum mechanical drill||0.15mm|
|Minimum laser drill||0.10mm standard, 0.075mm advanced|
What is a HDI PCB?
IPC-2226 defines HDI as a printed circuit board with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces ≤ 100 µm / 0.10mm, smaller vias (<150 µm) and capture pads <400 µm / 0.40mm, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology.
To prevent getting it wrong from the start, we have put together our design guidelines, to use as a checklist.